 |
Capabilities Summary
Systems Manufacturing
| • |
Work station build & test to packout |
Printed Circuit Board Assembly
| • |
BGA |
| • |
Micro BGA |
| • |
Surface mount (fine pitch 12 mil) |
| • |
Pin thru hole |
FPCMCIA Manufacturing
Fuii Testing Services
Materials Management
Repair Center Depot
Engineering Support
Prototype Support
Summit SRT BGA RoHS Rework System
3D XRAY NICHOLET 1525
|
 |
|
| |
• Material Control |
| |
Bestek has implemented a windows based software system for turnkey contract manufacturing that includes modules that provide the following:

|
|
 |
Pricing management through module control.
|
 |
The bill of material module coordinates purchased parts with WIP and stores and controls items
needing revision control
|
 |
Project management is achieved through computer control of part number, quantities and delivery
schedule (backlog of sales and scheduled workload)
|
 |
Product data management is controlled by engineering and is being integrated with our software
system. ECO's, work instructions, setup instructions and checklists are managed through the system
|
|
 |